发明名称 |
Color filter substrate, manufacturing method thereof and liquid crystal panel |
摘要 |
The present invention provides a color filter substrate, manufacturing method thereof and liquid crystal panel. The manufacturing method includes coating sequentially second photo-resist, third photo-resist and fourth photo-resist and performing respective exposure development to form RGB color-resist layer and form at least a protruding column on the BM layer; wherein the protruding column being formed by at least one of the three exposure developments; and forming common electrode layer covering RGB color-resist layer and the protruding column exceeding above top surface of the common electrode layer. As such, the present invention reduces the number of required lithography processes, simplifies the manufacturing process of color filter substrate and liquid crystal panel so as to reduce manufacturing cost. |
申请公布号 |
US9116297(B2) |
申请公布日期 |
2015.08.25 |
申请号 |
US201313811688 |
申请日期 |
2013.01.11 |
申请人 |
Shenzhen China Star Optoelectronics Technology Co., Ltd. |
发明人 |
Wu Chun-ming |
分类号 |
G02F1/1339;G02F1/1335;G02B5/22;G03F7/00;G02B5/20 |
主分类号 |
G02F1/1339 |
代理机构 |
|
代理人 |
Cheng Andrew C. |
主权项 |
1. A method of manufacturing color filter substrate, which comprises: providing a substrate;
coating a first photo-resist on the substrate and performing exposure development on the first photo-resist to form a black matrix (BM) layer surrounding a plurality of divided areas; coating sequentially a second photo-resist, a third photo-resist and a fourth photo-resist and performing respective exposure development to form RGB color-resist layer in divided areas and form at least a protruding column on the BM layer; wherein the protruding column being formed by at least one of the three exposure developments; and coating a common electrode layer on the substrate, the common electrode layer covering the RGB color-resist layer and the protruding column exceeding above top surface of the common electrode layer; and performing a patterning process on the common electrode layer so that the protruding column exceeding above top surface of the common electrode layer, and exposing top surface of the BM layer not disposed with protruding column. |
地址 |
Shenzhen, Guangdong CN |