发明名称 Chip comprising a radio frequency switch arrangement, circuit arrangement and method for producing a radio frequency circuit arrangement
摘要 A chip includes an RF switch arrangement that has a plurality of RF switches arranged jointly on the chip. Each of the RF switches has at least one first RF connection accessible from outside the chip and one second RF connection accessible from outside the chip. Furthermore, each of the RF switches is designed to activate, in response to a driving, at least one RF path between two of its RF connections. The RF connections of different switches from among the RF switches are separated from one another in terms of radio frequency.
申请公布号 US9118395(B2) 申请公布日期 2015.08.25
申请号 US201113228078 申请日期 2011.09.08
申请人 Infineon Technologies AG 发明人 Bakalski Winfried
分类号 H01P1/10;H04B1/44;H04B1/00;H03K17/00 主分类号 H01P1/10
代理机构 Slater & Matsil, L.L.P. 代理人 Slater & Matsil, L.L.P.
主权项 1. A chip comprising a radiofrequency switch arrangement, the chip comprising: a plurality of RF switches arranged jointly on the chip; wherein each of the RF switches from the plurality of RF switches has at least one separate first RF connection accessible from outside the chip and one separate second RF connection accessible from outside the chip and is configured to activate, in response to a driving, at least one RF path between two of its RF connections; wherein the RF connections of different switches from among the RF switches are separated from one another in terms of radio frequency; and a drive circuit arranged on the chip, the drive circuit being configured to provide, for each RF switch from the plurality of RF switches, a driving in such a way that at any point in time overall at most one RF path of the RF switches of the chip is activated, such that simultaneous activation of a plurality of RF paths of the RF switches is avoided.
地址 Neubiberg DE