Flip chip assembly and process with sintering material on metal bumps

摘要

A microelectronic package includes a substrate overlying the front face of a microelectronic element. A plurality of metal bumps can project from conductive elements of the substrate towards the microelectronic element, the metal bumps having first ends extending from the conductive elements, second ends remote from the conductive elements, and lateral surfaces extending between the first and second ends. A conductive matrix material can contact the second ends and at least portions of the lateral surfaces of respective ones of the metal bumps and join the metal bumps with contacts of the microelectronic element.

主权项

1. A microelectronic package, comprising:
a microelectronic element having a front face having contacts thereon; a substrate overlying the front face of the microelectronic element, the substrate including a plurality of terminals and a plurality of conductive pads electrically connected with the terminals; a plurality of wire bonds projecting from the conductive pads towards the microelectronic element, each wire bond having a first end and a second end opposite thereto, each of the first and second ends attached directly to a conductive pad of the plurality of conductive pads at attachment locations spaced apart from one another, wherein the wire bonds have lateral surfaces extending between the first and second ends; and a solid metal matrix having an open cell foam-like structure interspersed with at least one of a polymer or voids, the metal matrix formed from a conductive matrix material comprising a mixture of metals having substantially different melting-points and a non-metallic material, the conductive matrix material having been sintered in place with the second ends and at least portions of the lateral surfaces of respective ones of the wire bonds and with the contacts of the microelectronic element so as to fuse with the wire bonds and the contacts.