Methodologies and test configurations for testing thermal interface materials

摘要

Methodologies and test configurations are provided for testing thermal interface materials and, in particular, methodologies and test configurations are provided for testing thermal interface materials used for testing integrated circuits. A test methodology includes applying a thermal interface material on a device under test. The test methodology further includes monitoring the device under test with a plurality of temperature sensors. The test methodology further includes determining whether any of the plurality of temperature sensors increases above a steady state.

主权项

1. A test methodology, comprising:
applying a thermal interface material between a device and heat sink; applying power to the device; monitoring the device with a plurality of temperature sensors; and determining whether any of the plurality of temperature sensors increases above a steady state temperature to determine that the thermal interface material between the device and the heat sink can withstand test conditions without evaporating.