发明名称 Cutting elements with re-processed thermally stable polycrystalline diamond cutting layers, bits incorporating the same, and methods of making the same
摘要 A method of re-processing used TSP material layers to form cutting elements, bits with such cutting elements mounted on their bodies, and bits having re-processed TSP material layers attached to their bodies, as well as such cutting elements and bits are provided. The method includes providing a used TSP material cutting element having a TSP material layer and substrate, or a bit having a TSP material layer attached to the bit, removing the used TSP material layer from the cutting element or bit, cutting the used TSP material layer to a new shape, if necessary, optionally re-leaching the used TSP layer and re-using the TSP material layer to form a cutting element, or in forming a bit body. The formed cutting element may be mounted on a bit body.
申请公布号 US9115553(B2) 申请公布日期 2015.08.25
申请号 US201314048692 申请日期 2013.10.08
申请人 Smith International, Inc. 发明人 Zhang Youhe;Shen Yuelin;Keshavan Madapusi K.
分类号 E21B10/55;E21B10/567;B22F7/06;B23P6/00;B23P15/28;C22C26/00;B22F5/00 主分类号 E21B10/55
代理机构 Christie, Parker & Hale, LLP 代理人 Christie, Parker & Hale, LLP
主权项 1. A cutting element comprising: a substrate; and a thermally stable polycrystalline diamond (TSP) material cutting layer attached to the substrate, wherein said TSP material cutting layer having been subjected to at least two high temperature high pressure (HTHP) processes prior to being attached to the substrate, and wherein said TSP material layer is a polycrystalline diamond layer with at least a substantial portion of a catalyst in at least a portion of such layer having been removed.
地址 Houston TX US