Optical systems fabricated by printing-based assembly

摘要

Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

主权项

1. A method of making an integrated optical device comprising the steps of:
transfer printing a plurality of printable semiconductor elements to a device substrate; and addressing an optical component or an array of optical components with the plurality of printable semiconductor elements on the device substrate, wherein each of the plurality of printable semiconductor elements are optically addressed to the optical component or to a unique individual member of the array of optical components;wherein the transfer printing comprises the steps of:
contacting an array of solar cells on a wafer with a stamp contact surface; removing the stamp in a direction away from the wafer to transfer the array of solar cells from the wafer to the stamp contract surface; transferring the array of solar cells from the stamp contact surface to a back electrode supported by a target assembly substrate;wherein the method further comprises the steps of:
providing an insulating layer and front electrodes in electrical contact with the transferred array of solar cells; and addressing an array of microlenses with the transferred array of solar cells, wherein each microlens in the array is individually addressed and optically aligned with an individual solar cell.