发明名称 Storage server rack system and storage servers
摘要 A storage server rack system includes a rack and multiple storage servers assembled inside the rack. The rack includes an integrated power module and a fan wall. The integrated power module distributes a power to the storage servers. The fan wall is disposed by a side of the storage servers for dissipating heat. Each storage server includes a case, an electrical connection module, a motherboard and multiple storage units. The case has a first lateral side and a second lateral side disposed oppositely to each other. The electrical connection module is disposed on the first lateral side and connected to the integrated power module. The motherboard is disposed inside a first heat dissipation space in the case and electrically connected to the electrical connection module. The storage units are disposed outside the first heat dissipation space in the case and electrically connected to the electrical connection module.
申请公布号 US9116673(B2) 申请公布日期 2015.08.25
申请号 US201313775884 申请日期 2013.02.25
申请人 INVENTEC (PUDONG) TECHNOLOGY CORPORATION;INVENTEC CORPORATION 发明人 Xu Ji-Peng;Song Er-Zhen
分类号 G06F1/20;G06F1/18;H05K7/14 主分类号 G06F1/20
代理机构 Locke Lord LLP 代理人 Locke Lord LLP ;Xia, Esq. Tim Tingkang
主权项 1. A storage server rack system, comprising: a rack comprising an integrated power module and a fan wall; and a plurality of storage servers assembled inside the rack, the integrated power module is configured for distributing a power obtained outside of the rack to the storage servers, the fan wall being disposed on a side outside of the storage servers for dissipating the heat of the storage servers, each of the storage servers comprising: a case having a first lateral side and a second lateral side disposed oppositely to each other, a direction from the first lateral side to the second lateral side being defined as a first direction, the fan wall being configured for extracting an air current from the case oppositely along the first direction or blowing an air current toward the inside of the case along the first direction;an electrical connection module disposed on the first lateral side of the case and connected to the integrated power module;a motherboard disposed inside a first heat dissipation space in the case and electrically connected to the electrical connection module, the first heat dissipation space extending from the first lateral side toward the second lateral side along the first direction;a plurality of storage units disposed outside the first heat dissipation space in the case and electrically connected to the electrical connection module which is also disposed outside of the first heat dissipation space;at least one expansion unit disposed inside the case and electrically connected to the motherboard, each of the expansion units comprising at least one output interface or at least one input interface, and each of the output interfaces or each of the input interfaces of the expansion units being exposed out of the second lateral side of the case; andan expanding module disposed on each of the expansion units, each of the expanding modules comprising at least one output interface or at least one input interface, and each of the output interfaces or each of the input interfaces of each of the expanding modules being exposed out of the second lateral side of the case, and superimposed on the output interfaces or the input interfaces of each of the expansion units.
地址 Shanghai CN