Highly integrated miniature radio frequency module

摘要

A highly integrated miniature RF module includes a dielectric base board with opposing top and bottom metal layers and having interconnects traces, radio frequency (RF) circuits and semiconductor chips at the top metal layer and ground and signal pads at the bottom metal layer. Metalized vias extending through the dielectric material connect the top and bottom layers. A top cover made out of laminate material, such as FR-4, with opposing top and bottom metal layers and having machined compartments and channels, surrounded with arrays of metal plated vias extending through the laminate material, protects the RF circuits and chips and provide the required isolation and wave propagation.

主权项

1. A miniature RF module comprising: a base board formed from a single layer of dielectric material and opposing top and bottom metal layers, said top metal layer having etched interconnect lines and Radio Frequency (RF) circuits and said bottom metal layer having ground and signal pads; a number of packaged or bare die semiconductor chips mounted on said base board and that are operatively connected with said etched lines and RF circuits, and signal pads for receiving and outputting signals; a top cover formed of machined laminate material with apposing top and bottom metal layers is positioned over said base board for protecting said chips and bare die and providing required isolation and channelization; which said top cover comprises inside machined cavities and channels, lined-up with metal plated vias extending through the laminate material and connecting said top and bottom metal layers.