Alignment to multiple layers

摘要

A method of aligning a new pattern to more than one previously defined pattern during the manufacture of an integrated circuit. A method of aligning a photolighography pattern reticle to a first previously defined pattern in a first direction and also aligning the photolithography pattern reticle to a second previously defined pattern in a second direction. A method of aligning a photolighography pattern reticle to two previously defined patterns in the same direction.

主权项

1. A method of fabricating an integrated circuit, comprising:
forming a first patterned level having a first pattern in an integrated circuit chip and a first alignment mark separate from the first pattern and outside of the integrated circuit chip; forming, in a photoresist layer deposited on the integrated circuit chip, a second pattern and a second alignment mark separate from the second pattern and outside of the integrated circuit chip; aligning a reticle having a new pattern to the first alignment mark from the first patterned level and to the second alignment mark in the photoresist layer.