Insulation material for integrated circuits and use of said integrated circuits

摘要

The invention relates to the fields of microelectronics and materials sciences and concerns an insulation layer material for integrated circuits in microelectronics, which can be used, for example, in integrated circuits as insulation material in semiconductor components. The object of the present invention is to disclose an insulation material for integrated circuits, which has dielectric constants of k≦2 with good mechanical properties at the same time. The object is attained with an insulation material for integrated circuits, containing at least MOFs and/or COFs.

主权项

1. An integrated circuit comprising an insulation material, wherein the insulation material comprises
an adhesive, and at least one MOF and/or at least one COF;
whereinMOF means metallo-organic framework andCOF means covalent organic framework.