| 主权项 |
1. A method for filling recesses of a substrate with an insulation film, comprising:
(i) exposing surfaces of the recesses of the substrate to a pre-deposition gas in a reactive state in a reaction space to treat the surfaces with reactive hydrocarbons generated from the pre-deposition gas without filling the recesses, said pre-deposition gas being a hydrocarbon consisting of C and H but exclusive of methane, ethane, propane, ethylene, acetylene, and hexamethyldisilazane, said pre-deposition gas being excited by applying RF power to the reaction space under a pressure of about 100 Pa to about 1,200 Pa, whereby the surface of the recesses is rendered hydrophobic, having a water contact angle of more than 80° but less than 100°; and (ii) depositing a flowable insulation film using a process gas other than the pre-deposition gas on a surface of the substrate to fill the recesses treated in step (i) therewith by plasma reaction. |
