发明名称 Electronic component with terminal strips
摘要 An electronic component with terminal strips joined to end faces of external electrodes via a solder is characterized in that two plate-like supports of each terminal strip are formed by bending two plate-like parts projecting outward in a line-symmetrical manner from both side edges of a plate-like leg in the width direction such that at least tips of the thickness surfaces on the electronic component sides of the two plate-like parts are positioned below an external electrode of the electronic component, and the electronic component is supported from below by the tips of the thickness surfaces on the electronic component sides of the four plate-like supports. Slipping of the electronic component from both terminal strips due to melting of the solder can be suppressed in a reliable manner.
申请公布号 US9117595(B2) 申请公布日期 2015.08.25
申请号 US201314014114 申请日期 2013.08.29
申请人 TAIYO YUDEN CO., LTD. 发明人 Saito Naoki;Haga Katsunosuke;Oh Jae Hee
分类号 H01G4/228;H01G4/30;H01G4/232 主分类号 H01G4/228
代理机构 Law Office of Katsuhiro Arai 代理人 Law Office of Katsuhiro Arai
主权项 1. An electronic component with terminal strips, which comprises an electronic component having external electrodes on its opposing ends, as well as a terminal strip joined to each of the external electrodes, and which is configured to mount the electronic component onto a board or other mating part by both terminal strips, wherein: each of the terminal strips has a plate-like joint being joined via a solder to an end face of each of the external electrodes, a plate-like leg continuing from the plate-like joint, a plate-like mounting part continuing from the plate-like leg, and two plate-like supports continuing from the plate-like leg; the two plate-like supports are formed by bending inwardly, as viewed from above, two plate-like parts projecting in a line-symmetrical manner with reference to a direction perpendicular to an axis of the electronic component, from both side edges of the plate-like leg as viewed in a direction of the axis of the electronic component, such that at least a tip of a thickness surface on the electronic component side of each plate-like part is positioned below the electronic component and in contact with a bottom face of the corresponding external electrode; and the electronic component is supported from below by at least the tips of the thickness surfaces on the electronic component sides of the four plate-like supports.
地址 Tokyo JP
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