发明名称 High voltage connecting terminal for power supply
摘要 A high voltage connecting terminal for a power supply with improved insulating properties is disclosed. The high voltage connecting terminal may include a power connecting portion having a base plate mounted at one side of a conducting case in which a first opening and a first fastening hole are formed and a power connecting terminal formed to protrude at one side of the base plate, an insulating member interposed between the conducting case and the power connecting portion and having a third opening and a third fastening hole formed therein, and an insulating gasket mounted at the other side of the conducting case and having a fourth opening and a fourth fastening hole formed therein, the insulating gasket including a protruding portion formed along an outer circumference of the fourth opening so as to pass through the first opening.
申请公布号 US9118135(B2) 申请公布日期 2015.08.25
申请号 US201313837211 申请日期 2013.03.15
申请人 SAMSUNG SDI CO., LTD 发明人 Kwak Eun-Ok;Yoon Jong-Wook
分类号 H01R13/73;H01R13/40;H01R13/512;H01R13/74 主分类号 H01R13/73
代理机构 Knobble, Martens, Olson & Bear LLP 代理人 Knobble, Martens, Olson & Bear LLP
主权项 1. A high voltage connecting terminal for a power supply, comprising: a power connecting portion having a base plate mounted at one side of a conducting case in which a first opening and a first fastening hole are formed and having a second opening and a second fastening hole formed therein and a power connecting terminal formed outwardly to protrude at one side of the base plate; an insulating member interposed between the conducting case and the power connecting portion, the insulating member having a third opening and a third fastening hole formed therein; and an insulating gasket mounted at another side of the conducting case opposite the power connection portion, the insulating gasket having a fourth opening and a fourth fastening hole formed therein, and the insulating gasket having a protruding portion formed along an outer circumference of the fourth opening and formed to pass through the first opening, wherein at least one guide groove is formed in the first opening of the conducting case, and wherein a guide portion is formed on the protruding portion of the insulating gasket and formed to mate with and penetrate through the guide groove.
地址 Gyeonggi-do KR