发明名称 Conductive line system and process
摘要 A system and method for providing a conductive line is provided. In an embodiment the conductive line is formed by forming two passivation layers, wherein each passivation layer is independently patterned. Once formed, a seed layer is deposited into the two passivation layers, and a conductive material is deposited to fill and overfill the patterns within the two passivation layers. A planarization process such as a chemical mechanical polish may then be utilized in order to remove excess conductive material and form the conductive lines within the two passivation layers.
申请公布号 US9117881(B2) 申请公布日期 2015.08.25
申请号 US201313929641 申请日期 2013.06.27
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Huang Yu Yi;Kuo Hung-Jui;Liu Chung-Shi
分类号 H01L23/48;H01L23/52;H01L29/40;H01L21/768;H01L23/31;H01L23/29;H01L23/00;H01L23/532 主分类号 H01L23/48
代理机构 Slater & Matsil, L.L.P. 代理人 Slater & Matsil, L.L.P.
主权项 1. A semiconductor device comprising: a patterned negative tone photosensitive material over a substrate, the patterned negative tone photosensitive material comprising first openings; a patterned positive tone photosensitive material over the patterned negative tone photosensitive material, the patterned positive tone photosensitive material comprising second openings, wherein the patterned negative tone photosensitive material extends from a first sidewall of a first one of the second openings to a second sidewall of the first one of the second openings; a seed layer extending along sidewalls of the second openings; and a conductive material adjacent to the seed layer.
地址 Hsin-Chu TW