Chucking device and chucking method

摘要

A chucking device is provided, the chucking device having low dusting characteristics and high detergent properties, and being capable of vacuum-sucking even a substrate having a large warpage, and a chucking method using the chucking device is also provided. The chucking device vacuum-sucks and holds a wafer. The chucking device includes a perforated plate having a plurality of through-holes and being mounted with a wafer, the through-holes penetrating through both sides of the perforated plate; a porous plate that supports a surface other than a mounting surface of the perforated plate, on which the wafer is mounted, transmits a vacuum state to the wafer through the plurality of through-holes, and has a pore to limit a flow rate; and a vacuum pump that exhausts an air through the pore of the porous plate.

主权项

1. A chucking device that vacuum-sucks and holds a substrate, the chucking device comprising:
a first plate having a plurality of through-holes and being mounted with a substrate, the plurality of through-holes penetrating through both sides of the first plate; a member that supports a surface other than a substrate mounting surface of the first plate, transmits a vacuum state to the substrate through the plurality of through-holes, and limits a conductance; an exhaust unit that exhausts air through the member and the plurality of through-holes of the first plate; and a second plate having a plurality of through-holes and disposed on a side of the member opposite to the first plate, wherein the exhaust unit vacuum-sucks the substrate through the through-holes of the second plate, and wherein the member is a sheet member having a thickness smaller than that of the first and second plates.