发明名称 DEVICE FOR MOLDING COVERING
摘要 <p>PROBLEM TO BE SOLVED: To provide a device for molding a covering, capable of forming a resin covering on the outer casing of a control cable.SOLUTION: A guide member 21 for guiding the flow of resin includes a stepped part 22, of which the step 22A in a spiral form extends from an injection outlet side to the opposite side, and comes closer to the mouthpiece outlet 13C side as heading to the opposite side of the injection outlet. The step form is directed to dam the flow of resin. The difference in the level is reduced as the step comes closer to the mouthpiece outlet 13C side. The occurrence of a weld line (joint) can be inhibited at the collision site of the resin, so that the strength and the durability of a covering can be improved.</p>
申请公布号 JP2015150784(A) 申请公布日期 2015.08.24
申请号 JP20140026577 申请日期 2014.02.14
申请人 CHUO SPRING CO LTD 发明人 KUWAYAMA TOSHIO;HIRATA YUICHI;HAYASHIDA TAKAAKI;KOMAMOTO KOHEI
分类号 B29C47/28;B29C47/02;F16C1/26 主分类号 B29C47/28
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