SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing method which can perform dicing without using a dicer corresponding to a large diameter even when a wafer has the large diameter.SOLUTION: In a semiconductor manufacturing method, a large-diameter wafer W is quartered into four small-piece wafers Wa, for example, and by using the small-piece wafer Wa by being mounted on a general-purpose ring frame 171 having a small inner diameter, even when a diameter of the wafer is a large diameter, dicing can be performed without using a dicer corresponding to the large diameter.