| 摘要 |
<p>PROBLEM TO BE SOLVED: To appropriately perform underfill-molding and over-molding of a flip-chip mounted semiconductor device.SOLUTION: A device for molding a semiconductor device (1) in which a semiconductor chip (2) is flip-chip mounted on a substrate (3) with resin, comprises: a mold die (101) having an upper die (102) and a lower die (103); and a movable cavity (104) provided on the mold die (101). In the device, a resin is injected in a state where an exposure surface of the semiconductor chip (2) and a cavity inner surface of the mold die (101) are arranged closely or tightly so as to restrict or prevent a flow of a resin on the exposure surface of the semiconductor chip (2), and a resin is filled between the semiconductor chip (2) and the substrate (3). Then, a distance between the exposure surface of the semiconductor chip (2) and the cavity inner surface is widened by the movable cavity (104), and the exposure surface of the semiconductor chip (2) is covered with the resin.</p> |
