| 摘要 |
<p>PROBLEM TO BE SOLVED: To save a labor for an assembly process of a power conversion device.SOLUTION: The power conversion device includes: a power semiconductor module; a casing which includes a coolant channel and an opening communicating to the coolant channel and in which the power semiconductor module inserted from the opening into the coolant channel is cooled by housing the power semiconductor module; a mounting member that is different from the power semiconductor module and the casing for mounting the power semiconductor module to the casing; and a sealing member which is brought into press-contact with a surface of the casing in the vicinity of the opening in the state where the power semiconductor module is mounted to the casing by the mounting member, for sealing the coolant channel. The mounting member includes a first mounting part for mounting the mounting member to the power semiconductor module and a second mounting part for mounting the mounting member to the casing.</p> |
