| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which does not cause a major obstacle in via hole processing while supporting reduction in thickness and warpage of the semiconductor device at the same time.SOLUTION: A semiconductor device comprises a rewiring structure and a semiconductor chip on a surface of the rewiring structure, in which the semiconductor chip is coated with a hardened material of prepreg which includes a fiber material. Provided is the semiconductor device in which the prepreg includes a glass fiber material. Provided is the semiconductor device in which the prepreg includes an organic fiber material.</p> |
