发明名称 OPTICAL SENSING APPARATUS USED FOR FABRICATING LIGHT EMITTING DIODE PACKAGE
摘要 <p>Disclosed is an optical sensing apparatus for manufacturing an LED package, which is comprised in an apparatus for manufacturing the LED package which manufactures the LED package comprising an LED and a piece of a fluorescent film automatically. The disclosed optical sensing apparatus for manufacturing the LED package comprises: a sensor for injecting a resin which is comprised in a resin injection unit, and senses a position of an LED mounting groove in order to align a syringe discharging a liquid sealing resin to the LED mounting groove with the LED mounting groove; a film piece pickup sensor which is comprised in a film piece pickup unit, and senses a position and a posture of a piece of a fluorescent film optically from a film piece supply unit before the fluorescent film piece is picked up by a pick-up collet which picks up the fluorescent film piece by absorbing the fluorescent film piece one by one; and a sensor for mounting a film piece which senses the position and the posture of the LED mounting groove optically in order to align the pick-up collet absorbed with the fluorescent film piece with the LED mounting groove filled with the sealing resin.</p>
申请公布号 KR101546883(B1) 申请公布日期 2015.08.24
申请号 KR20140081828 申请日期 2014.07.01
申请人 PEOPLE AND TECHNOLOGY, INC. 发明人 KIM, JUN SUB;KIM, KYUNG WOOG;CHAI, JONG HUN
分类号 H01L33/50;H01L33/52 主分类号 H01L33/50
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