SEMICONDUCTOR CHIP AND SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To improve signal quality in a semiconductor chip.SOLUTION: A semiconductor chip comprises a signal pad 121, a ground pad 122, a signal cell 131, a power cell 132, a signal line 124 and a ground line 125. The signal pad is provided on a chip substrate 110. The ground pad is provided on the chip substrate. The signal cell is provided on the chip substrate. The ground cell is provided on the chip substrate. The signal line connects the signal cell and the signal pad and the ground line is wired along the signal line to connect the ground cell and the ground pad.