| 摘要 |
PROBLEM TO BE SOLVED: To prevent excessive application of a bonding load.SOLUTION: A manufacturing method of a semiconductor device comprises: a process (a) of preparing a wire bonding device 1; a process (b) of lowering a bonding tool 40 to a position where a part of a wire 42 is brought into contact with an electrode 125 as a first bond point provided on a free end of a semiconductor device 100; a process (c) of further lowering the bonding tool 40 so that the free end of the semiconductor device 100 is deflected in a state where a part of the wire 42 is brought into contact with the electrode; a process (d) of bonding a part of the wire 42 to the electrode by application of at least ultrasonic vibration; and a process (e) of moving the bonding tool 40 upward so as to return the free end of the semiconductor device 100 to the original position. In the process (e), the bonding load applied to the bonding tool 40 when lowering the bonding tool 40 is detected, and a lowering distance of the bonding tool 40 is controlled on the basis of the detection result. |
