| 发明名称 |
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board and a manufacturing method thereof.SOLUTION: The printed circuit board includes an adhesive film disposed between an insulating layer and a circuit pattern, thereby having increased adhesive strength in spite of a low roughness value and allowing formation of a fine circuit pattern and enhancement in reliability. |
| 申请公布号 |
JP2015154073(A) |
申请公布日期 |
2015.08.24 |
| 申请号 |
JP20140146679 |
申请日期 |
2014.07.17 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD;KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY |
发明人 |
PARK YONG JIN;IM SUNG GAP;KO YEONG GWON;YOU JAE BUM;KIM SHIN YOUNG |
| 分类号 |
H05K3/38;B32B15/08;B32B27/30;C09J4/00;C09J4/02;C09J5/00;C09J163/10;C09J179/00;C09J179/02;C09J201/02 |
主分类号 |
H05K3/38 |
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