| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultraviolet light emitting device that can enhance heat radiation performance while the packaging density of plural ultraviolet LED chips is increased, and an interposer used for the ultraviolet light emitting device.SOLUTION: A packaging board 3 (interposer 10a) has a support body 30, plural first surface electrodes 31a, a conductor portion 332, a first terminal portion 32, a second terminal portion 33 and a heat sink 34. The conductor portion 332 has plural opening portions 333. Each site just below a second electrode 28 of each of plural ultraviolet LED chips 2 constitutes a second surface electrode 31b. The plural first surface electrodes 31a are respectively commonly connected to the first terminal portion 32 through a first penetration wire 35, the heat sink 34 and a second penetration wire 36. The second terminal portion 33 is formed integrally with the conductor portion 332 on a surface 30a of the support body 30. The packaging board 3 has plural metal portions just below the conductor portion 332. A second end portion 39b of each metal portion 39 is connected to the heat sink 34. |
