发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that has high developability, gives a cured product having excellent elasticity recovery property and adhesiveness, and allows formation of a high-definition spacer.SOLUTION: The photosensitive resin composition comprises: a polyfunctional (meth)acrylate (A) containing a polyfunctional (meth)acrylate (A1) having a hydrophile-lipophile balance of 8 or more and 30 or less by 50 to 100 wt.%; and a photopolymerization initiator (B). It is preferable that (A1) has an oxyalkylene group. It is preferable that the composition further contains a silane compound having two or more hydrolyzable alkoxy groups, a hydrophilic binder resin (D), a solvent (E), or the like.
申请公布号 JP2015152726(A) 申请公布日期 2015.08.24
申请号 JP20140025542 申请日期 2014.02.13
申请人 SANYO CHEM IND LTD 发明人 YAMASHITA MAYUKO;SAKAI MASARU
分类号 G03F7/027;G02B5/20;G02F1/1339;G03F7/075 主分类号 G03F7/027
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