| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve isolation performance between conductors which are exposed on a surface of a mold compact while maintaining high heat radiation performance and low impedance.SOLUTION: A semiconductor module comprises: a first semiconductor element; a second semiconductor element; a mold compact for molding the first semiconductor element and the second semiconductor element; a first conductor which is electrically connected to a bottom electrode of the first semiconductor element and has a first part exposed on an undersurface of the mold compact and a second part extending from the first part to the inside of the mold compact; and a second conductor which is electrically connected to an upper electrode of the second semiconductor element and has a third part exposed on a top face of the mold compact and a fourth part extending from the third part to the inside of the mold compact, in which the fourth part is opposite to the second part of the first conductor.</p> |
