| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin sealed type semiconductor device having a lead having excellent solder wettability.SOLUTION: Notch work is applied to a lead 20 covered with a solder plating layer 5 from the upper surface, etching is performed from the central part 40 of the notch tip to form a barrel-shaped lead parent material removal part 80, and the solder plating layer of the mounting surface is exposed into the lead parent material removal part. Then, the solder plating layer exposed into the barrel-shaped lead parent removal part is cut off from the mounting surface side, and a folding part is formed on the end surface of the lead.</p> |
