HOLLOW STRUCTURE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT HAVING HOLLOW STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a method for easily manufacturing a hollow structure on a substrate with high precision.SOLUTION: A method for manufacturing a hollow structure 50 comprises the following first to third steps in this order. In the first step, a die 5 having a protrusion 5a is pressed against one surface F1 of a work 10a made of a resin composition, in which a leading end portion 5b of the protrusion 5a is not forced to reach the other surface F2 of the work 10a, leaving the resin composition between the other surface F2 of the work 10a and the leading end portion 5b. In the second step, the die is removed from the work 10a, thereby obtaining a work 10b with a concave portion 10c formed on one side thereof, provided that the concave portion is formed by the protrusion 5a. The third step includes: putting together the work 10b and a substrate 2, in which a surface of the substrate 2 and the surface F2 of the work 10b with the concave portion 10c formed therein are put together, whereby a structure having a hollow part 20 formed by the surface of the substrate 2 and the concave portion 10c is obtained.