发明名称 PLATING JIG FOR SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To provide a plating jig applicable to a square-shaped substrate, uniformly applying a surface pressure to a seal packing, and achieving easy sealing operation at the same time.SOLUTION: The plating jig includes: a substrate holder 1 having a substrate accommodation part 14 for accommodating a square-shaped substrate on the top face, and a plurality of claw parts 15 around the substrate accommodation part; a substrate holder cover 2 which holds the substrate between itself and the substrate holder 1 and has an angular opening 25 for exposing a surface to be plated in a state to hold the substrate, with a conductive member and a seal packing 6 for covering a peripheral part of the substrate; and a clamp ring 3 rotatably fixed to the top face of the substrate holder cover, having an angular opening for exposing the surface to be plated, with a plurality of engaging projections 341. The claw parts 15 disposed on a plurality of concentric circles having a center point at approximately the center of the substrate accommodation part include concave grooves. When the clamp ring is rotated, the engaging projections are accommodated in the corresponding concave grooves, respectively.</p>
申请公布号 JP2015151577(A) 申请公布日期 2015.08.24
申请号 JP20140026288 申请日期 2014.02.14
申请人 JCU CORP 发明人 YOSHIOKA JUNICHIRO;MURAYAMA TAKASHI;HORIUCHI AKIO
分类号 C25D17/08;C25D17/06;H01L21/683 主分类号 C25D17/08
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