| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring mounting structure having connection wiring highly accurately formed and suppressing disconnection and short circuit of the connection wiring, and further to provide a manufacturing method thereof, a liquid ejection head and a liquid ejection device.SOLUTION: A wiring mounting structure comprises at least: a first layer 33A provided with connection wiring 33 at a first substrate 30 side and a second substrate 10 side; and a second layer 33B formed on the first layer 33A. In at least the connection wiring 33 (333) formed on an inclined surface 321, surface roughness of an opposite side surface of the second layer 33B to the first layer 33A is greater in comparison with surface roughness of a second layer 33B side of the first layer 33A.</p> |
