| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a reflow device and a reflow method which materializes energy saving of the reflow device using an infrared ray heating method.SOLUTION: A reflow device 1 for performing reflow processing for a base material S while travelling the base material S subjected to Sn plating or Sn alloy plating includes a reflow processing part 5 which heats the base material S and fuses an Sn or Sn alloy plating layer. Therein, a first heater part 5a provided with a plurality of infrared ray heaters 8 which irradiate the base material S with infrared rays and a second heater part 5b provided with an infrared ray heater 8 which irradiates the base material S with infrared rays are disposed on the reflow processing part 5, respective infrared ray heaters 8 are arranged in parallel in the width direction W of the base material S such that the longitudinal direction of the respective infrared ray heaters 8 runs in the proceeding direction T of the base material S on the first heater part 5a, the longitudinal direction of the infrared ray heaters 8 is arranged in the width direction W of the base material S on the second heater part 5b and the respective infrared ray heaters 8 are configured so as to be respectively independently actuated.</p> |
