CONDUCTION STRUCTURE, MANUFACTURING METHOD OF THE SAME, DROPLET DISCHARGE HEAD, AND PRINTER

摘要

PROBLEM TO BE SOLVED: To provide a conduction structure which easily achieves high density of wiring between substrates and enables easy manufacturing and a manufacturing method of the conduction structure which enables efficient manufacturing of the conduction structure, and to provide a droplet discharge head which includes the conduction structure and enables easy downsizing and a printer including the droplet discharge head.SOLUTION: A conduction structure of the invention includes: a device substrate 10B (a first substrate); an IC 9 (a second substrate) including an upper surface 92 and an end surface 94a; a sealing plate 10A (a third substrate) including an upper surface 265 and an end surface; a conductive layer 281 including a first portion 291 provided on an upper surface of the device substrate 10B, a second portion 292 provided on the end surface 94a of the IC 9 and connected with the first portion 291, a third portion 293 provided on the upper surface 92 of the IC 9 and connected with the second portion 292, and a fourth portion 294 provided on the end surface of the sealing plate 10A and connected with the first portion 291 and the second portion 292; and a plated layer 282 overlapping with the conductive layer 281.