发明名称 |
RESIN COMPOSITION CONTAINING POLYIMIDE PRECURSOR, CURED FILM AND MANUFACTURING METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition excellent in photocurability on a substrate having a copper wiring and from which a cured film has low stress.SOLUTION: There is provided a resin composition containing following (a) component, (b) component and (c) component: (a) a polyimide precursor having a structural unit represented by the following formula (1), where Ris a tetravalent organic group, Ris a bivalent organic group, Rand Rare each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms or a monovalent organic group having a carbon-carbon unsaturated double bond; (b) a photopolymerizable compound having an ethylenically unsaturated bond; (c) a triaryl imidazole dimer, a phosphine oxide compound or an alkylphenone compound. |
申请公布号 |
JP2015151404(A) |
申请公布日期 |
2015.08.24 |
申请号 |
JP20140023520 |
申请日期 |
2014.02.10 |
申请人 |
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD |
发明人 |
ONO TAKASHI;ENOMOTO TETSUYA;OE TADAYUKI;SUZUKI KEIKO;SOEJIMA KAZUYA;SUZUKI ETSUHARU |
分类号 |
C08L79/08;C08K5/07;C08K5/3445;C08K5/5397;C09D4/00;C09D7/12;C09D179/08;G03F7/027;G03F7/029;G03F7/031;H01L21/027 |
主分类号 |
C08L79/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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