发明名称 POLYAMIDE-BASED RESIN COMPOSITION AND POLYAMIDE-BASED RESIN STRETCHED FILM
摘要 <p>PROBLEM TO BE SOLVED: To provide a polyamide-based resin oriented film using a semi-aromatic polyamide resin having improved and optimized transparency, heat resistance, low water absorption and stretch moldability.SOLUTION: There is provided a polyamide-based resin composition mainly containing a mixture (X) consisting of: 90 to 55 mass% of a crystalline semi-aromatic polyamide resin (A) consisting of an aromatic dicarboxylic acid component (a-1) mainly containing terephthalic acid and a diamine component (a-2) mainly containing hexamethylene diamine; and 10 to 45 mass% of a non-crystalline semi-aromatic polyamide resin (B) consisting of a dicarboxylic acid component (b-1) mainly containing terephthalic acid and/or isophthalic acid and a diamine component (b-2) mainly containing hexamethylene diamine and/or a hexamethylene diamine derivative, and having single glass transition temperature Tg (X) of the mixture (X).</p>
申请公布号 JP2015151446(A) 申请公布日期 2015.08.24
申请号 JP20140025435 申请日期 2014.02.13
申请人 MITSUBISHI PLASTICS INC 发明人 HASUIKE MAHO;TANAKA KAZUYA
分类号 C08L77/06;B29C55/14;C08G69/26 主分类号 C08L77/06
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