发明名称 HEAD ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a head assembly which enables efficient drive, so as to obtain a desired head element displacement amount, without increasing the size of a thin film piezoelectric element.SOLUTION: A head assembly 2 includes a first link 39a which is connectively disposed between a first joint 40a connected to a slider support plate 20 and a second joint 40b connected to first fixing means 24a, a second link 39b which is connectively disposed between a third joint 40c connected to the slider support plate 20 and a fourth joint 40d connected to second fixing means 24b, first driving means 16a which drives the first link 39a, and second driving means 16b which drives the second link 39b.
申请公布号 JP2015153433(A) 申请公布日期 2015.08.24
申请号 JP20140024289 申请日期 2014.02.12
申请人 TDK CORP 发明人 KUWASHIMA HIDEKI;SOMEYA HIROSHI
分类号 G11B21/21;G11B5/60;G11B21/10 主分类号 G11B21/21
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