发明名称 SEMICONDUCTOR DEVICE
摘要 On a semiconductor substrate, coils CL5 and CL6 and pads PD5, PD6, and PD7 are formed. The coil CL5 and the coil CL6 are electrically connected in series between the pad PD5 and the pad PD6, and the pad PD7 is electrically connected between the coil CL5 and the coil CL6. The coil magnetically coupled to the coil CL5 is formed just below the coil CL5, the coil magnetically coupled to the coil CL6 is formed just below the coil CL6, and they are connected in series. When a current is flowed in the coils connected in series formed just below the coils CL5 and CL6, directions of induction current flowing in the coils CL5 and CL6 are opposed to each other in the coils CL5 and CL6.
申请公布号 KR20150096391(A) 申请公布日期 2015.08.24
申请号 KR20157014915 申请日期 2012.12.19
申请人 RENESAS ELECTRONICS CORPORATION 发明人 UCHIDA SHINICHI;NAGASE HIROKAZU;FUNAYA TAKUO
分类号 H01L23/522;H01L23/00;H01L23/495;H01L23/528;H01L27/06 主分类号 H01L23/522
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