PHOTOSENSITIVE ADHESIVE COMPOSITION, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive adhesive composition having a buffer coat characteristic capable of forming a continuous thin film and a high definition adhesive pattern when a semiconductor device is produced by laminating a plurality of semiconductor chips and having good adhesiveness after a moisture absorption reflow test.SOLUTION: There is provided a photosensitive adhesive composition containing (A) an alkali soluble resin having a phenolic hydroxyl group, (B) a compound generating acid by light, and (C) a thermal crosslinking agent containing three or more groups crosslinked to the (A) component with the content of the (C) component of 5 pts.mass or more based on 100 pts.mass of the (A) component. There is provided the photosensitive adhesive composition where the (B) component includes o-quinonediazido compound and the (C) component is a thermal crosslinking agent having a benzene ring.