| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a thin printed wiring board capable of suppressing warpage in a process of mounting components.SOLUTION: The printed wiring board includes first and second solder resist layers, in which a thickness t(μm) of the first solder resist layer and an elastic modulus (at 23°C) G(GPa) of the layer after cured, a thickness t(μm) of the second solder resist layer and an elastic modulus (at 23°C) G(GPa) of the layer after cured, and a thickness Z (μm) of the printed wiring board satisfy the following conditions (1) to (3), and Gis 6 or more. The conditions are: (1) Z≤250; (2) (t+t)/Z≥0.1; and (3) G×[t/(t+t)]+G×[t/(t+t)]≥6.</p> |
