| 摘要 |
<p>A wafer cleaning apparatus according to the present invention includes a cleaning both which receives a cleaning solution for cleaning a wafer; stand arms which are formed in the cleaning bath, and have grooves which are in a row and receive some of the wafers; a guide which is combined with both ends of the stand arm; and an ultrasonic wave generation part which emits an ultrasonic wave to the wafer. The stand arms comprise at least two sets. Each of the sets can support the wafer alternately according to the period. According to the wafer cleaning apparatus of the present invention, the generation of a dead zone to which an ultrasonic wave is not transmitted can be prevented. The formation of a particle pattern generated by concentrically leaving particles on the dead zone can be prevented. Consequentially, impurities attached onto the entire surface of the wafer can be removed.</p> |
