| 摘要 |
PROBLEM TO BE SOLVED: To provide a component built-in substrate capable of conducting an electronic component, mounted on an insulating layer, with other electronic component easily and reliably, and suitable for thinning.SOLUTION: A buried hole 2a provided in a base substrate 2 is filled with a resin layer 6, and since the external electrode 3a of a first electronic component 3 built in the resin layer 6, and the external electrode 4a of a second electronic component 4, i.e., a surface-mount component mounted on the base substrate 2, are superposed directly not through a via hole and brought into conduction state, conduction failure due to positional deviation of a via hole can be eliminated, and the substrate can be made thin because the via hole is eliminated. |
