| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a radiator capable of mounting a plurality of ICs of different thicknesses, mounted on a printed circuit board, simultaneously to one radiator without exceeding a bearable load value of the ICs and a radiator mounting structure.SOLUTION: A radiator 10 includes a heat radiation part 11. The heat radiation part includes projection plane parts 12 each having a plane part 13 being in contact with an exothermic body. The plane part includes counterbore parts 14. A peripheral part of the projection plane part includes a groove 15. The groove includes a through hole 16 that penetrates the heat radiation part.</p> |
