INTEGRATED CIRCUIT PACKAGE AND METHODS OF FORMING SAME

摘要

Disclosed is a method for forming an integrated circuit package. Multiple first stage stacks are mounted on a substrate, the substrate includes one or more contact pad corresponding to each first stage stack, and each first stage includes one or more probe pad related to each first stage stack. Each first stage stack is electrically tested for identifying a known good (KG) first stage stack and a known bad (KB) first stage stack. Multiple first stack substrates are mounted on the KG first stage stack, and accordingly multiple second stage stacks are formed. Each second stage stack is electrically tested for identifying a KG second stack and a KB second stage stack.