AUTOMATIC SOLDERING DEVICE

摘要

The present invention relates to an automatic soldering device comprising: a base to make up a body; an elevation plate to be moved up and down on the base, wherein a base plate is provided on a top; a pair of Y-axis moving blocks facing each other to be moved in a Y-axis direction on the base above the elevation plate; a connection shaft to connect the Y-axis moving blocks; an X-axis moving block provided on the connection shaft to be moved in an X-axis direction; an iron passing through the X-axis moving block, having an iron tip on a bottom to be heated with a power supply; a bobbin installed in the X-axis moving block facing the iron to be rotated, wherein lead is wound on a circumference; a supply roller to take out the lead wound on the bobbin to supply it to the iron tip of the iron; and a controller to control operation of the elevation plate, the X-axis and the Y-axis moving block, and the supply roller.