| 摘要 |
<p>The present invention pertains to an electronic device manufacturing method, said electronic device including a detachable glass substrate and a member for an electronic device. The method comprises: a resin layer-forming step for forming a resin layer by applying a curable resin composition onto a first main surface of the detachable glass substrate which has the first main surface and a second main surface, the first main surface exhibiting easy detachability, and by performing a curing treatment on the uncured curable resin composition layer on the detachable glass substrate; a laminating step for obtaining a pre-cutting laminate by laminating a support substrate, which has smaller external dimensions than the external dimensions of the resin layer, on the resin layer such that the resin layer retains a peripheral edge region that is not in contact with the support substrate; a cutting step for cutting the resin layer and the detachable glass substrate along the outer peripheral edge of the support substrate in the pre-cutting laminate; a member-forming step for obtaining a laminate having the member for an electronic device, by forming the member for an electronic device on the second main surface of the detachable glass substrate; and a separating step for obtaining an electronic device from the laminate having the member for an electronic device, by separating therefrom the electronic device which has the detachable glass substrate and the member for an electronic device.</p> |
