SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

The present invention provides a semiconductor device with favorable excess water tolerance. The present invention increases adhesion between a semiconductor chip (2) and an encapsulation resin (8) by forming an area (25) with large unevenness on the upper surface of the semiconductor chip (2) covered by the encapsulation resin (8) and an area (24) with small unevenness on the lower surface thereof, thereby preventing the penetration of moisture from the outside.