ELECTRONIC COMPONENTS EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF

摘要

An electronic component embedded substrate and a manufacturing method thereof are disclosed. The electronic component embedded substrate according to an embodiment of the present invention includes: a core substrate formed with a cavity and a first circuit pattern; an electronic device which has an electrode terminal formed on one side thereof, and is arranged in the cavity; a first insulating layer formed on the other side of the electronic device; a second circuit pattern formed on the first insulating layer; and a second insulating layer which is filled in the cavity, and is stacked on both sides of the core substrate to cover the electronic device.