发明名称 DIVCON MICROCHANNELS HEAT SINK FOR ELECTRONIC CHIP COOLING
摘要 <p>To improve the cooling efficiency and reduce the pressure drop characteristics of the microchannels heat sink used in electronic chip cooling system, four new divergent-convergent microchannel designs are disclosed here. The proposed designs are oval, trapezoidal channel, diamond and conical channels. The cross-sectional area of the channels is first increasing and then decreasing along the channel length. The channels use a pumped fluid like water and alcohol as the coolant. By dividing the channel length into diverging and converging sections and varying the other design size parameters, the designs are showing better pressure drop and heat removing characteristics than conventionally used rectangular channels. An array of the proposed microchannels can be incorporated into a single heat sink to achieve a very high rate of cooling of the electronic chips while keeping the coolant pumping power and cost low.</p>
申请公布号 IN2972MU2015(A) 申请公布日期 2015.08.21
申请号 IN2015MU02972 申请日期 2015.08.06
申请人 ANSARI MOHD. ZAHID 发明人 ANSARI MOHD. ZAHID;SINGHAL ROHIT
分类号 H01L23/473;H05K7/20 主分类号 H01L23/473
代理机构 代理人
主权项
地址