发明名称 SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, PRINTED WIRING BOARD, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a surface treated copper foil excellently bonded with a resin and excellent in transparency of the resin after a copper foil is removed by etching, and a laminate using the same.SOLUTION: In an observation point-lightness graph, Sv defined by a formula (1) is 3.5 or more when a difference between a top average value Bt and a bottom average value Bb in a lightness curve is set toΔB, a value showing a position of the intersection nearest to a line-shaped mark is set to t1 out of intersections between the lightness curve and Bt, and a value showing a position of the intersection nearest to the line-shaped mark is set to t2 out of intersections between the lightness curve and 0.1ΔB in a depth range to 0.1ΔB from the intersections between the lightness curve and the Bt using the Bt as a reference. The surface treated copper foil includes any one or more kinds of elements selected from Ni and Co on the surface treated surface. Sv=(ΔB×0.1)/(t1-t2) (1)</p>
申请公布号 JP2015148011(A) 申请公布日期 2015.08.20
申请号 JP20150012825 申请日期 2015.01.26
申请人 JX NIPPON MINING & METALS CORP 发明人 FUKUCHI RYO;NAGAURA YUTA;ARAI EITA;MIKI ATSUSHI;ARAI YASUNORI;NAKAMURO KAICHIRO
分类号 C25D7/06;B32B15/08;C25D5/16;H05K1/09;H05K3/38 主分类号 C25D7/06
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