发明名称 |
SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, PRINTED WIRING BOARD, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a surface treated copper foil excellently bonded with a resin and excellent in transparency of the resin after a copper foil is removed by etching, and a laminate using the same.SOLUTION: In an observation point-lightness graph, Sv defined by a formula (1) is 3.5 or more when a difference between a top average value Bt and a bottom average value Bb in a lightness curve is set toΔB, a value showing a position of the intersection nearest to a line-shaped mark is set to t1 out of intersections between the lightness curve and Bt, and a value showing a position of the intersection nearest to the line-shaped mark is set to t2 out of intersections between the lightness curve and 0.1ΔB in a depth range to 0.1ΔB from the intersections between the lightness curve and the Bt using the Bt as a reference. The surface treated copper foil includes any one or more kinds of elements selected from Ni and Co on the surface treated surface. Sv=(ΔB×0.1)/(t1-t2) (1)</p> |
申请公布号 |
JP2015148011(A) |
申请公布日期 |
2015.08.20 |
申请号 |
JP20150012825 |
申请日期 |
2015.01.26 |
申请人 |
JX NIPPON MINING & METALS CORP |
发明人 |
FUKUCHI RYO;NAGAURA YUTA;ARAI EITA;MIKI ATSUSHI;ARAI YASUNORI;NAKAMURO KAICHIRO |
分类号 |
C25D7/06;B32B15/08;C25D5/16;H05K1/09;H05K3/38 |
主分类号 |
C25D7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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