发明名称 POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT
摘要 A polyamide resin composition includes 100 parts by weight of a (a) polyamide resin; and 0.1 to 10 parts by weight of a (b) hydroxyl group- and carboxyl group-containing compound, wherein the (b) hydroxyl group- and carboxyl group-containing compound has a ratio (COOH/OH) of 0.01 to 5.0 of a rate (percentage) of a carboxyl group-derived peak area to a total peak area in a 13C-NMR spectrum to a rate (percentage) of a hydroxyl group-derived peak area to a total peak area in a 1H-NMR spectrum and has a degree of branching of 0.05 to 0.35.
申请公布号 US2015232617(A1) 申请公布日期 2015.08.20
申请号 US201314427717 申请日期 2013.09.12
申请人 TORAY INDUSTRIES, INC. 发明人 Masunaga Atsushi;Nakagawa Hiroshi;Umetsu Hideyuki
分类号 C08G69/26;C08L77/00;C08G69/00;C08K3/10 主分类号 C08G69/26
代理机构 代理人
主权项
地址 Chuo-ku, Tokyo JP