发明名称 |
POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT |
摘要 |
A polyamide resin composition includes 100 parts by weight of a (a) polyamide resin; and 0.1 to 10 parts by weight of a (b) hydroxyl group- and carboxyl group-containing compound, wherein the (b) hydroxyl group- and carboxyl group-containing compound has a ratio (COOH/OH) of 0.01 to 5.0 of a rate (percentage) of a carboxyl group-derived peak area to a total peak area in a 13C-NMR spectrum to a rate (percentage) of a hydroxyl group-derived peak area to a total peak area in a 1H-NMR spectrum and has a degree of branching of 0.05 to 0.35. |
申请公布号 |
US2015232617(A1) |
申请公布日期 |
2015.08.20 |
申请号 |
US201314427717 |
申请日期 |
2013.09.12 |
申请人 |
TORAY INDUSTRIES, INC. |
发明人 |
Masunaga Atsushi;Nakagawa Hiroshi;Umetsu Hideyuki |
分类号 |
C08G69/26;C08L77/00;C08G69/00;C08K3/10 |
主分类号 |
C08G69/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Chuo-ku, Tokyo JP |